| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide exposure equipment and a method therefor capable of avoiding an increase in cost while supporting various kinds of semiconductor elements, and capable of shortening time required for exposing one chip (one shot) on a wafer when exposing a small-sized chip. <P>SOLUTION: The exposure equipment includes a projection optical system for projecting a reticle pattern to a material to be processed for exposing the material by relatively scanning the reticle and the material. The equipment has an exposure region defining means for defining a slitlike exposure region. The exposure region is variable in a length in the scanning direction, and in a length in the direction orthogonal to the scanning direction. <P>COPYRIGHT: (C)2007,JPO&INPIT |
