| 发明名称 |
3D PRINTED ACTIVE ELECTRONIC MATERIALS AND DEVICES |
| 摘要 |
Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices. |
| 申请公布号 |
US2016218287(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201615003198 |
申请日期 |
2016.01.21 |
| 申请人 |
McAlpine Michael C.;Kong Yong Lin |
发明人 |
McAlpine Michael C.;Kong Yong Lin |
| 分类号 |
H01L51/00;H01L33/06;H01L33/38;H01L33/56;H01L33/62;G02C11/00;H01L51/50;H01L51/52;H01L51/56;H01L27/32;B29C67/00;G02C7/04;H01L33/00;H01L27/15 |
主分类号 |
H01L51/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
1. A method of making a device, comprising 3D printing an active electronic device comprising semiconducting materials. |
| 地址 |
Minneapolis MN US |
