发明名称 VAPOR DEPOSITION APPARATUS AND FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To accurately evaporate a necessary amount of organic material by heat to provide an organic thin film with a fine film quality. SOLUTION: In a vapor deposition apparatus, vapor generating devices 20a to 20c are connected to a discharge device 50 to supply vapor while other vapor generating devices 20a to 20c are cut off from the discharge device 50, so that vapors are not mixed together. After film formation, the vapor generating devices 20a to 20c are connected to an exhaust tank while kept cut off from the discharge device 50. The exhaust tank contains cooling means 85a to 85c, on which vapor discharged into the exhaust tank is deposited to form a deposited material 39, which is recovered and reused. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009087910(A) 申请公布日期 2009.04.23
申请号 JP20070280726 申请日期 2007.10.29
申请人 ULVAC JAPAN LTD 发明人 NEGISHI TOSHIO
分类号 H05B33/10;C23C14/24;H01L51/50 主分类号 H05B33/10
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