| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of sealing of an enclosure in an FED (Field Emission Display) without deteriorating the emission characteristics of electron sources. SOLUTION: The enclosuer of the FED is constituted of: a cathode board 1; an anode board 2; and a sealing frame 31. The anode board 2 is bonded to the sealing frame 31 with a frit glass 32, while the cathode board 1 is bonded to the sealing frame 31 with a frit glass 33. After the anode board 2 is bonded at a high temperature to the sealing frame 31 using the frit glass 32, the cathode board 1 is bonded at a lower temperature to the sealing frame 31 using the frit glass 33. Because the cathode board 1 is bonded at a relatively low temperature, the emission characteristics of electron sources formed on the cathode board 1 are not deteriorated in the bonding process. On the other hand, bonding the anode board 2 at a relatively high temperature gives a necessary strength to a sealing portion. COPYRIGHT: (C)2009,JPO&INPIT
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