| 摘要 |
PURPOSE: A connection unit used for a reliability test of a semiconductor device test apparatus is provided to improve reliability regarding a package level test of the semiconductor device, by simply supplying a connection unit and by providing a signal skew and a jitter signal. CONSTITUTION: A connection unit used for a reliability test comprises an insulating pad(106), a plurality of input leads(102,108,112,116), a plurality of output leads(104,110,114,118) and low resistance connection lines(105,120,122,124). The plurality of input leads are separated a predetermined interval from each other to receive signals supplied from drivers in a semiconductor device test apparatus through output pins of the apparatus. The plurality of output leads output the supplied signals to comparators of the apparatus through input pins, disposed on the insulating pad while corresponding to the plurality of input leads. The low resistance connection lines connect the corresponding input and output leads.
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