DRESSER FOR CMP MACHINING

摘要

PROBLEM TO BE SOLVED: To prevent generation of a micro scratch on a polished object resulting from chipping of abrasive grains by reducing dispersion in the projection height and contact surface of the abrasive grains, in a dresser for dressing abrasive cloth used in surface finishing of a semiconductor wafer and the like by CMP machining. SOLUTION: The abrasive grains 13 are bonded by a brazing material layer 14 to the surface of base metal 11 so that crystal faces are oriented together.