发明名称 |
NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nitride semiconductor light emitting diode with excellent appearance and a wire bonding property, capable of forming an ohmic contact even at an ordinary temperature without any special heat treatment process by forming a B metal and an N metal in double layers of Ta/Au, and to provide a method of manufacturing the nitride semiconductor light emitting diode. <P>SOLUTION: This invention provides the nitride semiconductor light emitting diode, comprising: a substrate 11 for growing up a gallium nitride system semiconductor material; an n-type nitride semiconductor layer 12 formed on the substrate 11; an active layer 13 formed on the n-type nitride semiconductor layer 12 so that at least a partial region on the n-type nitride semiconductor layer 12 may be exposed; a p-type nitride semiconductor layer 14 formed on the active layer 13; a transparent electrode layer 15 formed on the p-type nitride semiconductor layer 14 in order to establish the ohmic contact; a P side bonding pad formed on the transparent electrode layer 15 in double layers of Ta/Au; and an n side electrode formed on the exposed partial region of the n-type nitride semiconductor layer 12 in the double layers of Ta/Au. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005210050(A) |
申请公布日期 |
2005.08.04 |
申请号 |
JP20040140737 |
申请日期 |
2004.05.11 |
申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
RO JAE CHUL;CHO SANG DEOG;SAI SHOKAN |
分类号 |
H01L21/28;H01L21/00;H01L21/3205;H01L23/52;H01L33/32;H01L33/40 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|