发明名称 |
Method for the aftertreatment of a through hole of a component |
摘要 |
In prior art, through holes often have to be after-treated manually. Disclosed is a method allowing through holes to be after-treated in a chemical or electrochemical manner with the aid of a material-removing agent, the outer surface located around a discharge port of the through hole being protected accordingly from being attacked by the agent that is to be removed.
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申请公布号 |
US2006283717(A1) |
申请公布日期 |
2006.12.21 |
申请号 |
US20030539190 |
申请日期 |
2003.12.11 |
申请人 |
BLOCH PETER;JABADO RENE;KRUGER URSUS;KORTVELYESSY DANIEL;REICHE RALPH;RINDLER MICHAEL |
发明人 |
BLOCH PETER;JABADO RENE;KRUGER URSUS;KORTVELYESSY DANIEL;REICHE RALPH;RINDLER MICHAEL |
分类号 |
B23H5/00;B23H9/10;B23H9/16 |
主分类号 |
B23H5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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