| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electronic component that can improve solder deposition strength. SOLUTION: Two lead wires 3 of a chip type electronic component are laid including a couple of peak portions of a meandering shape and a couple of channels 4 are formed at the bottom surface of a resin plate 2 on which the chip type electronic component is fixed. Before accommodation of the lead wires 3 in the channel 4, width of the meandering shape part (formed in the horizontal direction of the resin plate) of the lead wires 3 in the width direction of the channel 4 is a little larger than the width A of the channel 4. After the lead wires 3 are stored within the channel 4, the couple of peak portions of the meandering shape respectively press the internal wall of the channel 4 because of elastic deformation generated by accommodation thereof within the channel and a pressing force of these peak portions suppresses the force of the lead wires 3 to move upward from the channel 4, resulting in stable fixing of the substrate. Moreover, since the lead wires 3 include the meandering shape part in the channel 4, a soldering area of the internal part within the channel of the lead wires 3 and a metal pattern of a printed circuit board becomes large thereby improving solder deposition strength. COPYRIGHT: (C)2008,JPO&INPIT
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