ADHESIVE FILM FOR SEMICONDUCTOR, DICING TAPE-INTEGRATED ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film that can sufficiently fill recesses and projections of a wiring board in a sealing process while preventing influences of curing by heat generating in a die bonding process or a wire bonding process, and that develops sufficient adhesive power by heating in a short time.SOLUTION: An adhesive sheet for a semiconductor has an adhesive layer, in which the adhesive layer shows a storage modulus of 3 MPa or less at 175°C measured at a frequency of 10 Hz by use of a dynamic viscoelasticity measurement device. After the adhesive layer is thermally press-bonded to a wiring board and cured at 150°C for 1 hour, the cured product of the adhesive layer shows a die shear strength of 0.3 MPa or more at 175°C.SELECTED DRAWING: None