| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that a flow process executed after a reflow soldering process causes a warp of a board, solder remelting, etc., due to heat from flow soldering, thus leading to the separation of an electronic component. <P>SOLUTION: A semiconductor device includes a semiconductor chip having a plurality of electrodes, a plurality of leads connected electrically to the electrodes of the semiconductor chip via bonding wires, and a resin on which the semiconductor chip is mounted. The leads is composed of two or more kinds of leads different in rigidity. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
