| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Fe-P copper alloy sheet in which the increase of strength and excellent oxide film adhesion are made consistent. SOLUTION: The Cu-Fe-P copper alloy sheet in which the content of Fe is relatively reduced, has a texture where the orientation distribution density in the Brass orientation measured by a crystal orientation analysis method using EBSP (Electron Backscatter Diffraction Pattern) by FE-SEM (Field Emission Scanning Electron Microscope) is≥25%, and further has the average crystal grain diameter of≤6.0μm, thus has high strength and has improved oxide film adhesion, so as to enhance the reliability of a semiconductor package. COPYRIGHT: (C)2008,JPO&INPIT
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