Shock tolerant heat dissipating electronics package

摘要

An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.

主权项

1. An electronics package comprising:
a housing defining a channel therethrough; a first electronics chassis disposed in the channel with a first inclined surface at an end thereof; a second electronics chassis disposed in the channel adjacent said first electronics chassis and with a second inclined surface at another end thereof; and a screw operatively disposed through the housing and configured to apply axial downward force to the first electronics chassis adjacent thereto; and a stop structurally integral with the housing and adjacent the second electronics chassis.