| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin sealing module which reliably improves the insulation quality of the resin sealing module where a semiconductor device is sealed in a module case, and to provide the resin sealing module.SOLUTION: A semiconductor device 24 includes a positioning section 36. The positioning section 36 comprises: a body 35 which covers a substrate 21 forming the semiconductor device 24; and multiple protrusions 34, 34 ... which protrude from the body 35 and contact with an inner surface 25a of a module case 25. The body 35 and the multiple protrusions 34, 34 ... may be integrally formed by a hard insulation resin, for example, an epoxy resin. |
