Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

摘要

A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.

主权项

1. A semiconductor package comprising:
a core plate having first and second surfaces on opposite sides thereof and a through hole defined therein; at least one interconnection layer disposed on the second surface of the core plate; a first semiconductor chip disposed in the through hole on the at least one interconnection layer and electrically connected to the least one interconnection layer; a chip pad disposed on the first semiconductor chip and the first surface of the core plate such that the first semiconductor chip is disposed between the chip pad and the interconnection layer; and at least one ball pad disposed on the first surface of the core plate and substantially coplanar with the chip pad, wherein the chip pad is a plate having a plurality of holes therein and wherein the at least one ball pad is apart from the chip pad.