| 摘要 |
To achieve reduction in the size of a module which is provided with a coil and an electronic component. This module 1 is provided with: a wiring board 2; an insulating layer 3 that is laminated on the lower surface of the wiring board 2; an annular coil core 4 that is embedded in the insulating layer 3; a coil electrode 5 that is wound around the coil core 4; electronic components 9a, 9b that are arranged in a region of the insulating layer 3, said region being inside the coil core 4; and an electronic component 9c that is mounted on the upper surface of the wiring board 2. Due to this configuration, the areas of the main surfaces of the wiring board 2 and the insulating layer 3 are not large in comparison to the cases where the electronic components 9a, 9b and 9c are mounted on the upper surface of the wiring board 2, and thus the module 1 is able to be reduced in size. |
