Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate

摘要

An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

主权项

1. An interposer comprising:
a glass substrate having a first surface and a second surface, the second surface substantially parallel with the first surface, the glass substrate comprising:
one or more optical vias extending through the glass substrate and substantially perpendicular to the first surface, the one or more optical vias comprising an optical isolation layer comprising a first optical polymer bonded to an interior glass surface of the one or more optical vias and an optical via core comprising a second optical polymer having a higher refractive index than the first optical polymer, the optical via core surrounded by and disposed in contact with the optical isolation layer and extending through the glass substrate and substantially perpendicular to the first surface; one or more base optical isolation layers comprising the first optical polymer deposited on at least a portion of one or more of the first surface and second surface of the glass substrate; one or more optical waveguides comprising the second optical polymer and deposited on at least a portion of the one or more base optical isolation layers, wherein the one or more optical waveguides are optically connected to at least one of the one or more optical via cores; and one or more upper optical isolation layers comprising the first optical polymer deposited over the one or more optical waveguides and the base optical isolation layer such that the optical waveguides are at least partially encapsulated by the first optical polymer.