| 摘要 |
An IC disk box comprises a box body (10) provided with a hollowed-out structure (11) and comprises an ejection mechanism (20). The ejection mechanism (20) comprises a substrate (23), and comprises a raised structure (24) for ejecting an IC wafer. The raised structure (24) is disposed on the substrate (23), is slidably assembled in the hollowed-out structure (11). The hollowed-out structure (11) and the raised structure (24) form a groove body structure for placing the IC wafer. In use, the raised structure (24) of the ejection mechanism (20) slides towards the interior of the hollowed-out structure (11), so that the IC wafer placed in the groove body structure is ejected, which helps to take out and turn over the IC wafer and also improves the safety of processing the IC wafer. |
