Methods and apparatus provide for applying an inorganic barrier layer to at least a portion of a flexible substrate (206), the barrier layer being formed from a low liquidus temperature (LLT) material (202),- and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
申请公布号
WO2008069930(A3)
申请公布日期
2009.03.05
申请号
WO2007US24435
申请日期
2007.11.26
申请人
CORNING INCORPORATED;AITKEN, BRUCE G;BOOKBINDER, DANA C;GARNER, SEAN M;QUESADA, MARK A
发明人
AITKEN, BRUCE G;BOOKBINDER, DANA C;GARNER, SEAN M;QUESADA, MARK A
