SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC WAVES SHIELDING MEANS AND, METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof having a electromagnetic wave shielding unit are provided to simplify an electromagnetic wave shielding structure. CONSTITUTION: A semiconductor chip(14) is attached to a chip adhesion area(12) on a substrate(10). A signal transmission wire(20) connects a bonding pad of a semiconductor chip(16) to a conductive patter(18) for the wire bonding on a substrate. A molding resin(22) is molded through an upper side of the substrate, embeds and seals the semiconductor chip and the signal transmission wire. A grounding wire(24)'s inner end is fixed to the conductive pattern for the wire bonding of the substrate. The grounding wire's external end is exposed through a side boundary face of the molding resin.