| 摘要 |
<p>An apparatus for exposing a wafer is provided to reduce the exposure time of the semiconductor photo process by exposing quickly the edge of wafer. The apparatus for exposing a wafer comprises the wafer chuck(200), the first optical source unit(300), and the second optical source unit. The wafer is mounted in a unit for supporting wafer. The wafer chuck rotates the wafer in a direction. The first light source unit is arranged to be positioned in the upper portion of the wafer chuck. The second optical source unit is arranged in the upper side of the wafer chuck. The second optical source section is separated from the first optical source section and is arranged in the edge of wafer. Each of the first and second optical source units irradiates the light for the rotational motion of wafer in the edge of wafer.</p> |
