| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device capable of preventing cracking due to thermal stress of glass and a short circuit between electrodes even when the glass is used for a sealer. <P>SOLUTION: When the light-emitting device 10 using the glass for the sealer is manufactured, an LED element 12 is mounted on a substrate portion 11, a liquid material is dripped on a circumference of the LED element 12 to form a buffer layer 13 covering the LED element 12, and the buffer layer 13 is cured to seal the LED element 12, covered with the cured buffer layer 13, with the glass. <P>COPYRIGHT: (C)2009,JPO&INPIT |
