SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, WIRING BASE MATERIAL FOR CONNECTING SEMICONDUCTOR DEVICE, WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in connection reliability and in reliability in retaining a metal layer.

SOLUTION: There is provided the semiconductor device which includes a conductive metal pattern having a semiconductor element connected thereto and in which they are sealed with a sealing material, wherein the conductive metal layer pattern is partly protruded and exposed in the thickness direction on the side opposite to the connection surface of the semiconductor element. The connection between the semiconductor element and the conductive metal layer pattern is wire bonding connection between predetermined positions between the semiconductor element and the conductive metal layer pattern, and they are sealed with a sealing material and the lower surface of the semiconductor element is exposed. Preferably, the portion having the maximum width in a cross surface shape of the conductive metal layer is buried in the sealing material.

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