WAFER FIXING TAPE, PROCESSING METHOD FOR SEMICONDUCTOR WAFER, AND SEMICONDUCTOR CHIP

摘要

Provided are: a wafer fixing tape comprising an adhesive layer on a substrate film, said substrate film including an ionomer resin obtained by crosslinking a terpolymer with a metal ion, wherein the surface of the substrate film on the opposite side to an adhesive layer 5b has an arithmetic mean roughness Ra of 0.1-3.0 μm; a processing method for a semiconductor wafer; and a semiconductor chip.