VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

摘要

Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

主权项

1. A system-in-a-package module comprising:
a substrate; a plurality of electrical components on a surface of the substrate; a vertical interconnect structure; an overmold over the plurality of electrical components and the vertical interconnect structure; and a top shield over the overmold, wherein the vertical interconnect structure extends from the surface of the substrate to a bottom of a shallow trench in a top surface of the overmold where it electrically connects to the top shield.