发明名称 SUBMINIATURE ELECTRICAL CONNECTOR MULTI-PIN GROUNDING/DISCRETE CIRCUIT BUSSING MODULE AND INTEGRAL CONNECTOR BACKSHELL
摘要 <p>A same potential block has a main body including a plurality of holes. A first metal piece, including a first carrier strip located adjacent to the main body and a plurality of clips extending from the first carrier. Each of the plurality of clips is positioned within a corresponding hole of the plurality of hole formed in the main body. A contact portion is positioned exterior and protruding from the main body and connected to the first metal piece to form a connector mating structure.</p>
申请公布号 WO2002063720(A2) 申请公布日期 2002.08.15
申请号 US2002001237 申请日期 2002.02.05
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