发明名称 MUTILAYER PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board having the excellent flexing property and durability of a flexible section and having high reliability and a manufacturing method for the multilayer printed-wiring board. SOLUTION: Resin boards 5 are arranged at four places of each of both upper and lower ends, and cut off at the center of a double-sided flexible wiring board 1 as the flexible section 12 in a complete wiring board to the double-sided flexible wiring board 1. Copper foils 6 are disposed on the whole front and back surfaces of the flexible wiring board 1 including the resin boards 5, thus manufacturing a substrate 10 as the laminate of the flexible wiring board 1, the resin boards 5 and the copper foils 6. Through-holes 7 are formed to rigid sections 11, plating layers 7a are formed on inwalls of the through-holes, external-layer patterns 8 are formed by etching the copper foils 6, and succeeding machining is applied to the substrate 10, thus manufacturing the multilayer printed-wiring board 10A. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005236205(A) 申请公布日期 2005.09.02
申请号 JP20040046552 申请日期 2004.02.23
申请人 SHARP CORP 发明人 UENO YUKIHIRO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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