| 摘要 |
PROBLEM TO BE SOLVED: To maintain the connection state immediately after wire bump and enable flip connection while keeping a bump share, by making a solder element of a solder bump in a part covering a connection electrode different from a solder element of a substrate side solder, and making a melting point of a substrate side solder lower than a melting point of a solder bump. SOLUTION: An electrode on a substrate 32 and an Al electrode 12 are subjected to flip-chip connection by using a solder bump 11 of metallic projection formed on a connection electrode (Al electrode) 12 of a semiconductor chip 13 as a connection medium. A solder element of the solder bump 11 of a part covering the Al electrode 12 is made different from a solder element of a substrate side solder 41, and a melting point of the substrate side solder 41 is made lower than a melting point of the solder bump 11. As a result, it is possible to protect an interface between the Al electrode 12 and the solder bump 11 from peeling phenomenon and to maintain the connection state immediately after wire bump, to realize flip-chip connection while keeping bump share strength. Furthermore, flip-chip connection can be realized without fusing a solder element at the side of the Al electrode 12. |
