| 摘要 |
PROBLEM TO BE SOLVED: To provide a sub mount capable of exhibiting excellent transmission characteristics of high frequency signals and exhibiting a heat shielding property. SOLUTION: The sub mount is configured in such a way that a high frequency line conductor 3 is deposited on one principal surface of a rectangular insulating substrate 1, a connection connected to an external electronic element on one end side of the insulating substrate 1 is formed on an upper surface of the line conductor 3, and a packaging part, where an inner electronic element for delivering a signal with the external electronic element is packaged is provided on the other end side from the connection. In the sub mount, a notch 4 communicating with fresh air via at least one end side side surface of the insulating substrate 1 is formed just under the connection. COPYRIGHT: (C)2006,JPO&NCIPI
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