POWER MODULE SUBSTRATE WITH HEAT SINK AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink and provide a power module, which can inhibit warpage occurring on the heat sink even when a plurality of power module substrates are arranged and ensure favorable heat radiation performance.SOLUTION: In a power module substrate 100A with a heat sink in which a plurality of power module substrates 10 in which a circuit layer 12 is bonded to one surface of a first ceramic substrate 11 and a heat radiation layer 13 is bonded to the other surface of the first ceramic substrate 11 are laid side by side in a planar direction of a heat sink 50, the power module substrate 10 is bonded to the one surface of the heat sink 50 via a linking substrate 20A having a second ceramic substrate 21 and a backside substrate 30A having a third ceramic substrate 31 is bonded to the other surface of the heat sink 50.SELECTED DRAWING: Figure 1