Alignment of three dimensional integrated circuit components

摘要

A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.

主权项

1. A method for aligning a chip onto a substrate comprising:
depositing a ferrofluid, the ferrofluid being a colloidal liquid made of magnetic nanoparticles suspended within a solvent and having a particular surface tension, onto a substrate having one or more pads that electrically couple to a semiconductor layer; placing a chip with one or more solder balls that electrically couple to logic elements of the chip onto the deposited ferrofluid; supporting the chip on the ferrofluid, in a substantially coplanar orientation to the substrate; determining that the one or more solder balls of the chip are misaligned from a desired location on the one or more pads of the substrate; and adjusting, in response to the determination that the one or more solder balls of the chip are misaligned from the desired location on the one or more pads of the substrate, a position of the ferrofluid within a three-dimensional space with a magnetic field until the one or more solder balls of the chip are aligned in the desired location on the one or more pads of the substrate.