| 摘要 |
PROBLEM TO BE SOLVED: To provide a package and a manufacturing method thereof wherein its solder disposing process can be completed only by one operation. SOLUTION: In the package, an element substrate 11 is so disposed that an air gap 100 is formed between it and a sealing substrate 13. A spacer 25 has a first frame-form surface 251 joined by a solder to the sealing substrate 13, a second frame-form surface 252 joined by a solder to the element substrate 11, an inner periphery surface 253 which connects inner peripheries of frame-forms of the first and second surfaces 251, 252 with each other, and an outer periphery surface 254 having a solder wettability higher than that of the inner periphery surface 253 which connects outer peripheries of frame-forms of the first and second surfaces 251, 252 with each other. COPYRIGHT: (C)2009,JPO&INPIT
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