| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electro-optic device, in which a terminal can be prevented from damages even when the terminal is exposed by dicing stacked and adhered wafers, an electro-optic device, and an electronic apparatus.SOLUTION: An electro-optic device 100 is manufactured by stacking and adhering a first wafer 10 where a mirror 50 and a terminal 17 are fabricated to a second wafer for sealing, and then dicing the wafers. A recess 21 to overlap the mirror 50 in a plan view is formed in a second surface 20s of the second wafer 20 as well as a groove 22 to overlap the terminal 17 in a plan view is formed. Thereby, upon dicing the wafers by allowing a dicing blade 82 for the second wafer to intrude from a third surface 20t of the second wafer 20 along the groove 22, the dicing blade 82 for the second wafer can be prevented from coming into contact with the terminal 17.SELECTED DRAWING: Figure 5 |
