Housing semiconductor chips

摘要

A housing arrangement for a plurality of semiconductor chips (1) is disclosed, in which each of the chips is received in a respective frame or cassette (4), the arrangement comprising a first electrically conductive member (5), having portions (6) which are in electrical connection with one face of each of the chips and a second electrically conductive member (7), having portions (8) which are in electrical connection with an opposite face of each of the chips.