| 发明名称 |
RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE |
| 摘要 |
<p>The present invention relates to a resin composition for electronic component encapsulation including: A: a cyanate ester resin; B: at least one selected from the group consisting of a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler.</p> |
| 申请公布号 |
KR20110102840(A) |
申请公布日期 |
2011.09.19 |
| 申请号 |
KR20110021855 |
申请日期 |
2011.03.11 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
KITAGAWA YUYA;TABUCHI YASUKO |
| 分类号 |
C08L67/06;C08K3/00;C08L61/28;H01L23/29 |
主分类号 |
C08L67/06 |
| 代理机构 |
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代理人 |
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