| 摘要 |
The present invention relates to a test device for a semiconductor device. The present invention provides a test device for a semiconductor device, which includes: a first socket in which a package having a semiconductor device for a test mounted thereto is received; and a second socket which is coupled to the first socket, wherein the first socket includes: a first substrate that is formed at an upper end of the first socket, has a cavity adapted to receive the package, first contact pads for holding input and output terminals of the package, the first contact pads being provided at opposite ends of the cavity, and second contact pads electrically connected to the first contact pads, respectively, a heater which is formed at a lower end of the first socket and heats the semiconductor device, and a signal transmitting unit which is connected to the second contact pads to receive a predetermined signal from an external power source or transmit an output signal from an output terminal of the package to the external power source, and wherein the second socket includes a temperature detecting unit for measuring the temperature of the semiconductor device, and an insulating part including protrusions which are arranged on input and output terminals of the package and make the input and output terminals of the package come into contact with the first contact pads. The test device for a semiconductor device according to the present invention may test electric characteristics and reliability of the semiconductor device at a high temperature as well as test electric characteristics of the semiconductor device at the room temperature. |
