| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing device and a wafer processing method capable of easily and accurately processing an outer peripheral surface of a wafer. <P>SOLUTION: This wafer processing device includes a rotary mechanism 16 for rotating a laminated body S in a state of holding both sides in the laminating direction of the wafer in the laminated body S, a rotary grinding wheel 14 arranged so as to be capable of contacting with an outer peripheral surface of the rotating laminated body S and grinding the outer peripheral surface of the laminated body S in a columnar shape, and a polishing means 15 arranged along the outer peripheral surface of the laminated body S and polishing the outer peripheral surface of the laminated body S in a state of interposing an abrasive W between the rotating laminated body S and itself. <P>COPYRIGHT: (C)2011,JPO&INPIT |
