PROBE CARD AND METHOD OF PRODUCTION

摘要

PROBLEM TO BE SOLVED: To provide a probe card which transmits a signal between an integrated circuit and an external semiconductor tester at the time of testing the external semiconductor tester. SOLUTION: The probe card 100 comprises a probe 92, a substrate 94, a signal transmission line 96, a ground conductor part 98 and a hole part 102. The signal transmission line 96 is formed on the substrate 94 made of a dielectric material or a semiconductor material. The probe 92 is formed of a metallic glass material at the forward end of the signal transmission line 96 on one side of the substrate 94. The probe 92 can be formed very finely utilizing micromachining technology of metallic glass material. The probe 92 is formed above the hole part 102 while spaced apart from the substrate 94. The probe 92 exhibits resiliency in the direction perpendicular to the surface of the substrate 94 and can touch a connection terminal formed in a circuit to be tested resiliently during test. Since the probe 92 is formed of a metallic glass material, the inventive probe card 100 can transmit a high frequency signal to an integrated circuit having a large number of pads at a fine pitch.