发明名称 Plasma etching process used in manufacture of half tone phase masks comprises etching a pattern in a molybdenum-silicon compound layer using a chlorine compound
摘要 Plasma etching process comprises etching a pattern in a MoSi(ON) layer using a chlorine compound. Preferred Features: An inert gas is added to the chlorine compound. The inert gas is helium, argon or nitrogen. Polymer-containing CH4 is added to the chlorine compound. O2 is added to the chlorine compound in small amounts.
申请公布号 DE10100822(A1) 申请公布日期 2002.07.18
申请号 DE2001100822 申请日期 2001.01.10
申请人 INFINEON TECHNOLOGIES AG 发明人 MATHUNI, JOSEF;RUHL, GUENTHER
分类号 G03F1/00 主分类号 G03F1/00
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