| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of wire bonding process that a mark dedicated for recognition of the relative positional coordinate of a bonding place is put on the surface of a semiconductor chip and reduction of chip size is limited correspondingly. SOLUTION: As a reference point being used by a wire bonder for grasping a bonding place, marks 14 for recognizing the positional coordinate relative to a plurality of bonding positions are put on two bonding pads 11, 12 of a semiconductor chip.
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