| 摘要 |
The purpose of the present invention is to maintain flatness of a surface in a transparent mold resin layer after turning, to suppress consumption of a cutting unit, and to promote high speed machining when the transparent mold resin of an optical device wafer is turned. According to the present invention, a method for machining an optical device wafer (1) comprises: a first turning process of roughly turning a transparent mold resin (13) of the optical device wafer (1) by applying a cutting tool (43a) to the transparent mold resin (13) while rotating the cutting tool (42a) including a cutting unit formed of a sintered body including diamond; and a second turning process of turning and finishing the transparent mold resin (13) to a desired thickness by applying a cutting tool (43b) while rotating the cutting tool (43b) including a cutting unit including single crystal diamond after the first turning operation. |
