| 发明名称 |
THERMAL ANALYSIS OF ELECTRONICS RACKS |
| 摘要 |
A technique for performing thermal analysis of an electronics rack is disclosed. In one embodiment, the electronics rack having multiple heat generating components is modeled. Further, thermal boundary conditions for each of the heat generating components are computed, by a computation fluid dynamics tool (CFD) tool, based on an initial temperature and a heat flux corresponding to each of the heat generating components in a first cycle, upon modeling the electronics rack. Furthermore, an actual temperature of each of the heat generating components is determined, by a one dimensional (1D) tool, using the computed thermal boundary conditions for estimating heat dissipated by each of the heat generating components in the first cycle. |
| 申请公布号 |
US2016327437(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201615149090 |
申请日期 |
2016.05.07 |
| 申请人 |
AIRBUS GROUP INDIA PRIVATE LIMITED ;AIRBUS OPERATIONS GMBH |
发明人 |
TIWARI PUNIT;CHUGH KRISHAN;GIESE TIM |
| 分类号 |
G01K13/00;G01N25/18 |
主分类号 |
G01K13/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of performing thermal analysis of an electronics rack, comprising:
modeling the electronics rack having multiple heat generating components; computing thermal boundary conditions for each of the heat generating components, by a computation fluid dynamics (CFD) tool, based on an initial temperature and a heat flux corresponding to each of the heat generating components in a first cycle, upon modeling the electronics rack; and determining an actual temperature of each of the heat generating components, by a one dimensional (1D) tool, using the computed thermal boundary conditions for estimating heat dissipated by each of the heat generating components in the first cycle. |
| 地址 |
Bangalore IN |
