| 摘要 |
There exist a need in the art for an IC package that prevents the popcorn effect through every process step in forming an electronic device, as well as during operation of the device. This need is met by an integrated circuit package and a method of manufacturing an integrated circuit package which, during dispensing of an adhesive layer includes at least one via formed by dispensing the adhesive layer in a pattern such that it enables the release of vapor trapped in the integrated circuit package after the attachment of the heat spreader. |
