| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of detecting a polishing end point in a CMP apparatus by which the polishing end point can be detected by an appropriate quantity of light. <P>SOLUTION: In the CMP apparatus, a workpiece 8 to be polished is held on a turning workpiece holding device 21, and while a polishing liquid 25 is being supplied, a polishing object 23 is brought into contact with the workpiece 8 from the upper side of the workpiece 8, and the object 23 is turned and swung to polish the workpiece 8. In this case, an irradiation light is given to the surface of the workpiece 8 from a light source 1, and a photodetector 27 receives its reflected light to detect the end point of polishing on the basis of its characteristic. The method of detecting the polishing end point includes a step wherein the average of the measured values of the intensity of the reflected lights for n (n: integer of one or more) swing cycles on the polishing object 23 is calculated in the beginning of the step, and the intensity of the irradiated light is adjusted so that the average may be a specified value. <P>COPYRIGHT: (C)2007,JPO&INPIT |
