发明名称 PATTERN MEASUREMENT APPARATUS AND FLAW INSPECTION APPARATUS
摘要 The purpose of the present invention is to provide a pattern measurement apparatus that appropriately assesses patterns formed by patterning methods for forming patterns that do not exist on photomasks. In order to achieve this purpose, the present invention provides a pattern measurement apparatus comprising a calculation apparatus that measures the dimensions of patterns formed on a sample by using data acquired by irradiating the sample with a beam, wherein the calculation apparatus extracts pattern coordinate information on the basis of the data acquired by irradiating the sample with the beam, and uses the coordinate information to generate measurement reference data used when performing dimension measurements of the pattern.
申请公布号 WO2016117104(A1) 申请公布日期 2016.07.28
申请号 WO2015JP51757 申请日期 2015.01.23
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 SAKAI KEI;YAMAGUCHI SATORU;HIRAO KAZUYUKI;TAKASUGI YASUNORI
分类号 G01B15/00;H01J37/22;H01L21/66 主分类号 G01B15/00
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