发明名称 LASER BEAM MACHINING METHOD
摘要 <p>A laser beam machining method capable of accurately cutting a workpiece along predicted cut lines, comprising the steps of forming cut start areas (8) in the workpiece (1) along the predicted cut lines (5) by reformed areas (7) formed by multiple photon absorption, and radiating laser beam (L2) having a permeability for the non-reformed areas of the workpiece (1) onto the workpiece (1) along the predicted cut lines (5) to produce cracks (24) in the workpiece (1) starting at the cut start areas (5), whereby the workpiece (1) can be accurately cut along the predicted cut lines (5) and, since chips (25) are separated from each other by extending an extension film (19) for fixing the workpiece (1) thereto, the certainty of cutting of the workpiece (1) along the predicted cut lines (5) can be further increased.</p>
申请公布号 WO2004080642(A1) 申请公布日期 2004.09.23
申请号 WO2003JP02943 申请日期 2003.03.12
申请人 HAMAMATSU PHOTONICS K.K.;FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI;UCHIYAMA, NAOKI;WAKUDA, TOSHIMITSU;ATSUMI, KAZUHIRO;MURAMATSU, KENICHI 发明人 FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI;UCHIYAMA, NAOKI;WAKUDA, TOSHIMITSU;ATSUMI, KAZUHIRO;MURAMATSU, KENICHI
分类号 B23K26/42;B28D1/22;B28D5/00;H01L21/301;(IPC1-7):B23K26/38 主分类号 B23K26/42
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