PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY

摘要

A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

主权项

1. A method of forming a packaged microphone, the method comprising:
securing an array of covers to an array of molded frames to form an array of assemblies, each frame having a surface forming a concavity; mounting a plurality of microphone dies within a plurality of the concavities in the array of molded frames, each of the plurality of concavities having no more than one microphone die; securing an array of substrates to the array of assemblies to form an array of packages that each have interior volumes, each of the array of packages having a seal that forms a back volume and a front volume within the interior volume; and dicing the array of packages to form individual packages.