发明名称 半導体装置
摘要 A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edge. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.
申请公布号 JP6028592(B2) 申请公布日期 2016.11.16
申请号 JP20130012365 申请日期 2013.01.25
申请人 三菱電機株式会社 发明人 王 亞哲
分类号 H01L23/28;H01L21/56;H01L23/29;H01L23/31 主分类号 H01L23/28
代理机构 代理人
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