| 发明名称 |
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME |
| 摘要 |
Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches. |
| 申请公布号 |
US2016268216(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201615065850 |
申请日期 |
2016.03.09 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KIM Young-Ja;KIM Bongchan |
| 分类号 |
H01L23/552;H01L23/31;H01L21/3205;H01L21/56;H01L21/78 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a semiconductor package, comprising:
providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches and electrically connect conductive patterns at bottoms of the trenches. |
| 地址 |
Suwon-si KR |
