On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks

摘要

An apparatus including a package including a die and a package substrate, the package substrate including a conductor; and a stiffener body electrically coupled to the conductor of the package substrate. An apparatus including a package including a die and a package substrate; a stiffener body coupled to the package substrate; and an electrically conductive path between the stiffener body and the package substrate. A method including electrically coupling a stiffener body to a conductor of a package substrate.